67 lines
2 KiB
Text
67 lines
2 KiB
Text
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Device tree binding vendor prefix registry. Keep list in alphabetical order.
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This isn't an exhaustive list, but you should add new prefixes to it before
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using them to avoid name-space collisions.
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ad Avionic Design GmbH
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adi Analog Devices, Inc.
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aeroflexgaisler Aeroflex Gaisler AB
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ak Asahi Kasei Corp.
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amcc Applied Micro Circuits Corporation (APM, formally AMCC)
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apm Applied Micro Circuits Corporation (APM)
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arm ARM Ltd.
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atmel Atmel Corporation
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bosch Bosch Sensortec GmbH
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brcm Broadcom Corporation
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cavium Cavium, Inc.
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chrp Common Hardware Reference Platform
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cirrus Cirrus Logic, Inc.
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cortina Cortina Systems, Inc.
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dallas Maxim Integrated Products (formerly Dallas Semiconductor)
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denx Denx Software Engineering
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emmicro EM Microelectronic
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epson Seiko Epson Corp.
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est ESTeem Wireless Modems
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fsl Freescale Semiconductor
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GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
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gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
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hp Hewlett Packard
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ibm International Business Machines (IBM)
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idt Integrated Device Technologies, Inc.
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img Imagination Technologies Ltd.
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intercontrol Inter Control Group
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linux Linux-specific binding
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marvell Marvell Technology Group Ltd.
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maxim Maxim Integrated Products
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mosaixtech Mosaix Technologies, Inc.
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national National Semiconductor
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nintendo Nintendo
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nvidia NVIDIA
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nxp NXP Semiconductors
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onnn ON Semiconductor Corp.
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picochip Picochip Ltd
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powervr PowerVR (deprecated, use img)
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qcom Qualcomm, Inc.
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ralink Mediatek/Ralink Technology Corp.
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ramtron Ramtron International
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realtek Realtek Semiconductor Corp.
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renesas Renesas Electronics Corporation
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samsung Samsung Semiconductor
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sbs Smart Battery System
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schindler Schindler
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sil Silicon Image
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silabs Silicon Laboratories
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simtek
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sirf SiRF Technology, Inc.
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snps Synopsys, Inc.
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st STMicroelectronics
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ste ST-Ericsson
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stericsson ST-Ericsson
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ti Texas Instruments
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toshiba Toshiba Corporation
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via VIA Technologies, Inc.
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wlf Wolfson Microelectronics
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wm Wondermedia Technologies, Inc.
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winbond Winbond Electronics corp.
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xlnx Xilinx
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